HCL CAMWorks
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Mold Design Software Improvements

TopSolid’Mold 2009 dedicated mold design software from Missler features complete CAM integration with TopSolid’Cam. The software update enables calculation of the shrinkage factor; analysis of undercuts; calculation of the parting line and surface of the joint; automatic creation and definition of the core block and cavity; implementation of the standard carcass systems of injection and ejection; and analysis of the cooling system.  Molds can be designed in a collaborative environment with several users working at the same time, thus reducing design times.

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TopSolid’Mold 2009 dedicated mold design software from Missler features complete CAM integration with TopSolid’Cam. The software update enables calculation of the shrinkage factor; analysis of undercuts; calculation of the parting line and surface of the joint; automatic creation and definition of the core block and cavity; implementation of the standard carcass systems of injection and ejection; and analysis of the cooling system.
 
Molds can be designed in a collaborative environment with several users working at the same time, thus reducing design times. According to the company, the software offers intuitive design of complex parting surfaces as well as automatic management of changes made to them.

Different design methods can be used to manage cooling circuits ranging from simple designs to complex, elaborate circuits on 3D contours. To efficiently control components, the software detects dimensions to be used and guarantees their associativity during modification, the company says. Users can design the different parts of a circuit independently, which are subsequently assembled via a “drag-and-drop” operation. Numbering, designation and creation of the isometric view of the circuit are all accomplished with a simple click, the company says. The software also features advanced collision control. This allows users to manage the feasibility of a circuit by avoiding collisions between the components of the mold and the cooling circuits.

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