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Waida Mfg. Co., a specialty tool grinder manufacturer based in Japan, has opened a new office in Chicago, Illinois to serve the North American market. Products include jig and profile grinders for mold and die manufacturing as well as machines for the production of both inserts and tools with shanks, such as drills, reamers and end mills. While its prime focus is the cutting tool and mold and die industries, the company recently forayed into the semiconductor industry with the introduction of a machine designed for precision surface grinding of silicon wafers.
According to the company, its specialized machines are capable of grinding hard, brittle materials such as cemented carbide, ceramics, CBN and sintered diamond compacts using diamond-abrasive wheels.
