Machines
Sodick Breaks Ground on New, Larger Headquarters
The new facility is planned to include twice the square footage, including a dedicated additive technology tech center.
Read MoreID, OD, Face, Taper, Radius, Contour Grinding in Single Chucking
Eastec 2017: Hardinge Grinding Group, a subsidiary of Hardinge Inc., will showcase its USACH 100‐T4 machine for ID/OD precision cylindrical grinding in a variety of industries.
Read MorePortable VMC Streamlines Secondary Operations
Eastec 2017: Southwestern Industries will showcase the Trak 2OP, its portable VMC designed for secondary machining operations.
Read MoreMachining Center’s Ladder-Type Cross Rails Prevents Vertical-Axis Deformation
Eastec 2017: Takumi says its H10 double-column machining center’s rigidity and thermal stability make it well-suited for parts that require fast processing, high precision and quality surface finish.
Read MoreSMTCL Americas Hosts Open House Event
The company offered a number of discounts on the machine tools in its offering in collaboration with its partners.
Read MoreHorizontal Band Saw Features Automatic Feed Control
Eastec 2017: Behringer Saws’ HBE Dynamic-series horizontal band saw is designed to improve performance and precision while maximizing user convenience and safety.
Read MoreImage-Processing Laser Marking Equipment
Eastec 2017: Trumpf will display what it’s calling the TruMark image processing solution: the TruMark 5020 with Visionline Mark.
Read MoreAbrasive Waterjet Achieves High Positioning Accuracy
Eastec 2017: Omax’s MicroMax abrasive waterjet system offers positioning accuracy of less than 5 microns and is now equipped with a Tilt-a-Jet cutting head to achieve virtually zero taper.
Read MoreSliding Headstock Lathes Feature Low-Frequency Vibration
Eastec 2017: Marubeni’s Citizen Cincom L20 sliding headstock lathes are now available with Low Frequency Vibration (LFV).
Read MoreForm Grinder Achieves 1-Micron Stopping Accuracy
Eastec 2017: The UPZ-Li form grinder from Okamoto is designed for high-tolerance grinding of difficult materials in the electronics, form tool, fiber optics and other industries.
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